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  1 features description/ordering information sn74auc1g66 www.ti.com .......................................................................................................................................................... sces386l ? march 2002 ? revised july 2009 single bilateral analog switch 2 available in the texas instruments nanofree? low on-state impedance ? typically 9 ? package (v cc = 2.3 v) wide v cc range of 0.8 v to 2.7 v latch-up performance exceeds 100 ma per jesd 78, class ii sub-1-v operable esd protection exceeds jesd 22 low power consumption, 10- m a max i cc ? 2000-v human-body model (a114-a) high on-off output voltage ratio ? 200-v machine model (a115-a) high degree of linearity ? 1000-v charged-device model (c101) high speed ? max 0.2 ns (v cc = 1.8 v, c l = 15 pf) this single analog switch is operational at 0.8-v to 2.7-v v cc , but is designed specifically for 1.65-v to 1.95-v v cc operation. the sn74auc1g66 can handle both analog and digital signals. the combined ac and dc signal has to be between v cc and gnd for it to be transmitted in either direction. nanofree? package technology is a major breakthrough in ic packaging concepts, using the die as the package. applications include signal gating, chopping, modulation or demodulation (modem), and signal multiplexing for analog-to-digital and digital-to-analog conversion systems. 1 please be aware that an important notice concerning availability, standard warranty, and use in critical applications of texas instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. 2 nanofree is a trademark of texas instruments. unless otherwise noted this document contains copyright ? 2002 ? 2009, texas instruments incorporated production data information current as of publication date. products conform to specifications per the terms of texas instruments standard warranty. production processing does not necessarily include testing of all parameters. see mechanical drawings for dimensions. ncC no internal connection dbv package (top view) 5 1 v cc a 2 b 3 4 gnd c dck package (top view) 2 b 3 4 gnd v cc 5 a c 1 yzp package (bottom view) 2 b v cc 1 5 a gnd 4 3 c dry package (top view) b nc a 6 5 4 2 3 gnd c v cc 1 pre view
absolute maximum ratings (1) sn74auc1g66 sces386l ? march 2002 ? revised july 2009 .......................................................................................................................................................... www.ti.com ordering information t a package (1) (2) orderable part number top-side marking (3) nanofree? reel of 3000 SN74AUC1G66YZPR _ _ _u6_ wcsp (dsbga) ? yzp (pb-free) son ? dry reel of 5000 sn74auc1g66dryr preview ? 40 c to 85 c sot (sot-23) ? dbv reel of 3000 sn74auc1g66dbvr u66_ sot (sc-70) ? dck reel of 3000 sn74auc1g66dckr u6_ (1) package drawings, thermal data, and symbolization are available at www.ti.com/packaging . (2) for the most current package and ordering information, see the package option addendum at the end of this document, or see the ti website at www.ti.com . (3) dbv/dck/dry: the actual top-side marking has one additional character that designates the assembly/test site. yzp: the actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. function table control input switch (c) l off h on logic diagram (positive logic) over operating free-air temperature range (unless otherwise noted) min max unit v cc supply voltage range ? 0.5 3.6 v v i input voltage range (2) ? 0.5 3.6 v v i/o switch i/o voltage range (2) (3) ? 0.5 v cc + 0.5 v i ik control input clamp current v i < 0 ? 50 ma i iok i/o port diode current v i/o < 0 or v i/o > v cc 50 ma i t on-state switch current v i/o = 0 to v cc 50 ma continuous current through v cc or gnd 100 ma dbv package 206 dck package 252 q ja package thermal impedance (4) c/w dry package 234 yzp package 123 t stg storage temperature range ? 65 150 c (1) stresses beyond those listed under " absolute maximum ratings " may cause permanent damage to the device. these are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under " recommended operating conditions " is not implied. exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) all voltages are with respect to ground, unless otherwise specified. (3) the input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed. (4) the package thermal impedance is calculated in accordance with jesd 51-7. 2 submit documentation feedback copyright ? 2002 ? 2009, texas instruments incorporated product folder link(s): sn74auc1g66 b c a 14 2
recommended operating conditions (1) electrical characteristics switching characteristics sn74auc1g66 www.ti.com .......................................................................................................................................................... sces386l ? march 2002 ? revised july 2009 min max unit v cc supply voltage 0.8 2.7 v v cc = 0.8 v v cc v ih high-level input voltage v cc = 1.1 v to 1.95 v 0.65 v cc v v cc = 2.3 v to 2.7 v 1.7 v cc = 0.8 v 0 v il low-level input voltage v cc = 1.1 v to 1.95 v 0.35 v cc v v cc = 2.3 v to 2.7 v 0.7 v i/o i/o port voltage 0 v cc v v i control input voltage 0 3.6 v t/ v input transition rise or fall rate 20 ns/v t a operating free-air temperature ? 40 85 c (1) all unused inputs of the device must be held at v cc or gnd to ensure proper device operation. refer to the ti application report, implications of slow or floating cmos inputs, literature number scba004. over recommended operating free-air temperature range (unless otherwise noted) parameter test conditions v cc min typ (1) max unit v i = v cc or gnd, i s = 4 ma 1.65 v 10 20 r on on-state switch resistance v c = v ih ? i s = 8 ma 2.3 v 9 15 (see figure 1 ) v i = v cc to gnd, i s = 4 ma 1.65 v 32 80 r on(p) peak on resistance v c = v ih ? i s = 8 ma 2.3 v 15 20 (see figure 1 ) v i = v cc and v o = gnd, or 1 i s(off) off-state switch leakage current v i = gnd and v o = v cc , 2.7 v m a 0.1 (1) v c = v il (see figure 2 ) 1 v i = v cc or gnd, v c = v ih , v o = open i s(on) on-state switch leakage current 2.7 v m a (see figure 3 ) 0.1 (1) i i control input current v i = v cc or gnd 0 to 2.7 v 5 m a i cc supply current v i = v cc or gnd, i o = 0 0.8 v to 2.7 v 10 m a c ic control input capacitance 2.5 v 2 pf c io(off) switch input/output capacitance 2.5 v 3.5 pf c io(on) switch input/output capacitance 2.5 v 7 pf (1) all typical values are at t a = 25 c. over recommended operating free-air temperature range, c l = 15 pf (unless otherwise noted) (see figure 4 ) v cc = 1.2 v v cc = 1.5 v v cc = 1.8 v v cc = 2.5 v v cc = 0.8 v from to 0.1 v 0.1 v 0.15 v 0.2 v parameter unit (input) (output) typ min max min max min typ max min max t pd (1) a or b b or a 0.9 0.3 0.2 0.2 0.1 ns t en c a or b 4.1 0.5 2.6 0.5 1.7 0.5 0.8 1.1 0.5 1 ns t dis c a or b 5 0.7 3.6 0.5 2.6 0.5 1.7 2.9 0.5 2.2 ns (1) the propagation delay is the calculated rc time constant of the typical on-state resistance of the switch and the specified load capacitance, when driven by an ideal voltage source (zero output impedance). copyright ? 2002 ? 2009, texas instruments incorporated submit documentation feedback 3 product folder link(s): sn74auc1g66
switching characteristics sn74auc1g66 sces386l ? march 2002 ? revised july 2009 .......................................................................................................................................................... www.ti.com over recommended operating free-air temperature range, c l = 30 pf (unless otherwise noted) (see figure 4 ) v cc = 1.8 v v cc = 2.5 v from to 0.15 v 0.2 v parameter unit (input) (output) min typ max min max t pd (1) a or b b or a 0.3 0.3 ns t en c a or b 0.5 1.4 2.3 0.8 1.4 ns t dis c a or b 0.5 1.7 2.9 0.5 1.5 ns (1) the propagation delay is the calculated rc time constant of the typical on-state resistance of the switch and the specified load capacitance, when driven by an ideal voltage source (zero output impedance). 4 submit documentation feedback copyright ? 2002 ? 2009, texas instruments incorporated product folder link(s): sn74auc1g66
analog switch characteristics operating characteristics sn74auc1g66 www.ti.com .......................................................................................................................................................... sces386l ? march 2002 ? revised july 2009 t a = 25 c from to parameter test conditions v cc typ unit (input) (output) 0.8 v 60 1.1 v 60 c l = 50 pf, r l = 600 ? , f in = sine wave 1.4 v 80 (see figure 5 ) 1.65 v 120 2.3 v 170 frequency response (1) a or b b or a mhz (switch on) 0.8 v > 500 1.1 v > 500 c l = 5 pf, r l = 50 ? , f in = sine wave 1.4 v > 500 (see figure 5 ) 1.65 v > 500 2.3 v > 500 0.8 v 9 1.1 v 14 c l = 50 pf, r l = 600 ? , crosstalk c a or b f in = 1 mhz (square wave) 1.4 v 15 mv (control input to signal output) (see figure 6 ) 1.65 v 16 2.3 v 20 0.8 v ? 60 1.1 v ? 60 c l = 50 pf, r l = 600 ? , f in = 1 mhz (sine wave) 1.4 v ? 60 (see figure 7 ) 1.65 v ? 60 2.3 v ? 60 feedthrough attenuation (2) a or b b or a db (switch off) 0.8 v ? 55 1.1 v ? 55 c l = 5 pf, r l = 50 ? , f in = 1 mhz (sine wave) 1.4 v ? 55 (see figure 7 ) 1.65 v ? 55 2.3 v ? 55 0.8 v 7.5 1.1 v 0.16 c l = 50 pf, r l = 10 k ? , a or b b or a f in = 1 khz (sine wave) 1.4 v 0.04 (see figure 8 ) 1.65 v 0.03 2.3 v 0.02 sine-wave distortion % 0.8 v 4.2 1.1 v 0.2 c l = 50 pf, r l = 10 k ? , a or b b or a f in = 10 khz (sine wave) 1.4 v 0.03 (see figure 8 ) 1.65 v 0.02 2.3 v 0.02 (1) adjust f in voltage to obtain 0 dbm at output. increase f in frequency until db meter reads ? 3 db. (2) adjust f in voltage to obtain 0 dbm at input. t a = 25 c v cc = 0.8 v v cc = 1.2 v v cc = 1.5 v v cc = 1.8 v v cc = 2.5 v test parameter unit conditions typ typ typ typ typ power dissipation c pd f = 10 mhz 3 3 3 3 3 pf capacitance copyright ? 2002 ? 2009, texas instruments incorporated submit documentation feedback 5 product folder link(s): sn74auc1g66
parameter measurement information sn74auc1g66 sces386l ? march 2002 ? revised july 2009 .......................................................................................................................................................... www.ti.com figure 1. on-state resistance test circuit figure 2. off-state switch leakage-current test circuit 6 submit documentation feedback copyright ? 2002 ? 2009, texas instruments incorporated product folder link(s): sn74auc1g66 v cc v i = v cc or gnd v o r on  v i  v o i s  v i - v o gnd (on) v b or a c a or b v cc v ih v c i s condition 1: v i = gnd, v o = v cc condition 2: v i = v cc , v o = gnd v cc v i v o gnd (off) b or a c a or b v cc v il v c a
parameter measurement information (continued) sn74auc1g66 www.ti.com .......................................................................................................................................................... sces386l ? march 2002 ? revised july 2009 figure 3. on-state leakage-current test circuit copyright ? 2002 ? 2009, texas instruments incorporated submit documentation feedback 7 product folder link(s): sn74auc1g66 v cc v o gnd (on) b or a c a or b v cc v ih v c a v i = v cc or gnd v o = open
parameter measurement information (continued) sn74auc1g66 sces386l ? march 2002 ? revised july 2009 .......................................................................................................................................................... www.ti.com figure 4. load circuit and voltage waveforms 8 submit documentation feedback copyright ? 2002 ? 2009, texas instruments incorporated product folder link(s): sn74auc1g66 notes: a. c includes probe and jig capacitance. b. waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. c. all input pulses are supplied by generators having the following characteristics: prr 10 mhz, z = 50 , slew rate 1 v/ns. d. the outputs are measured one at a time, with one transition per measurement. e. t and t are the same as t . f. t and t are the same as t . g. t and t are the same as t . l o plz phz dis pzl pzh en plh phl pd w 3 0 v t w input 0 v input outputoutput voltage waveforms propagation delay times inverting and noninverting outputs voltage waveforms pulse duration v m v m v m v m v ol v oh v i v i v oh v ol v m v m v m v m t plh t phl t plh t phl t h t su data input timing input 0 v0 v output waveform 1 s1 at v (see note b) load output waveform 2 s1 at gnd (see note b) v ol v oh 0 v? 0 v output control v m v m v m v m v m voltage waveforms enable and disable times low- and high-level enabling voltage waveforms setup and hold times v i v i v i v m v m v /2 load t pzl t plz t phz t pzh v C v oh d v + v ol d from output under test c (see note a) l load circuit s1 v load open gnd r l r l t /t plh phl open test s1 v load t /t plz pzl gnd t /t phz pzh inputs v cc 2.5 v 0.2 v 0.8 v 1.2 v 0.1 v 1.5 v 0.1 v 1.8 v 0.15 v 2.5 v 0.2 v 1.8 v 0.15 v r l 500 w 2 k w 2 k w 2 k w 2 k w 2 k w 1 k w v load 2 v cc 2 v cc 2 v cc 2 v cc 2 v cc 2 v cc 2 v cc c l 30 pf 15 pf15 pf 15 pf 15 pf 15 pf 30 pf v d 0. v 15 0.1 v0.1 v 0.1 v 0.15 v 0. v 15 0. v 15 v i v cc v cc v cc v cc v cc v cc v cc v m v /2 cc v /2 cc v /2 cc v /2 cc v /2 cc v /2 cc v /2 cc t /t r f 2 ns 2 ns 2 ns 2 ns 2 ns 2 ns 2 ns
parameter measurement information (continued) sn74auc1g66 www.ti.com .......................................................................................................................................................... sces386l ? march 2002 ? revised july 2009 figure 5. frequency response (switch on) figure 6. crosstalk (control input ? switch output) copyright ? 2002 ? 2009, texas instruments incorporated submit documentation feedback 9 product folder link(s): sn74auc1g66 v cc v o gnd b or a c a or b v cc v c v ih r l c l 50 w 0.1 m f (on) v cc /2 r l /c l : 600 w /50 pf r l /c l : 50 w /5 pf f in v cc v o gnd b or a c a or b v cc v c c l 50 pf 50 w v cc /2 v cc /2 r in 600 w r l 600 w
parameter measurement information (continued) sn74auc1g66 sces386l ? march 2002 ? revised july 2009 .......................................................................................................................................................... www.ti.com figure 7. feedthrough (switch off) figure 8. sine-wave distortion 10 submit documentation feedback copyright ? 2002 ? 2009, texas instruments incorporated product folder link(s): sn74auc1g66 v cc v o gnd b or a c a or b v cc v c v ih r l 10 k w c l 50 pf 600 w 10 m f (on) v cc /2 v cc = 0.8 v , v i = __ v p-p v cc = 1.1 v , v i = __ v p-p v cc = 1.4 v , v i = __ v p-p v cc = 1.65 v , v i = 1.4 v p-p v cc = 2.3 v , v i = 2.5 v p-p f in 10 m f v cc v o gnd b or a c a or b v cc v c v il r l c l 50 w 0.1 m f (off) v cc /2 r l /c l : 600 w /50 pf r l /c l : 50 w /5 pf f in r l v cc /2
packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) sn74auc1g66dbvr active sot-23 dbv 5 3000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74auc1g66dbvre4 active sot-23 dbv 5 3000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74auc1g66dbvrg4 active sot-23 dbv 5 3000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74auc1g66dckr active sc70 dck 5 3000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74auc1g66dckre4 active sc70 dck 5 3000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74auc1g66dckrg4 active sc70 dck 5 3000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74AUC1G66YZPR active dsbga yzp 5 3000 green (rohs & no sb/br) snagcu level-1-260c-unlim (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. -- the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti to customer on an annual basis. package option addendum www.ti.com 3-aug-2009 addendum-page 1
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant sn74auc1g66dbvr sot-23 dbv 5 3000 180.0 8.4 3.23 3.17 1.37 4.0 8.0 q3 sn74auc1g66dckr sc70 dck 5 3000 180.0 8.4 2.24 2.34 1.22 4.0 8.0 q3 SN74AUC1G66YZPR dsbga yzp 5 3000 180.0 8.4 1.02 1.52 0.63 4.0 8.0 q1 package materials information www.ti.com 27-apr-2011 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) sn74auc1g66dbvr sot-23 dbv 5 3000 202.0 201.0 28.0 sn74auc1g66dckr sc70 dck 5 3000 202.0 201.0 28.0 SN74AUC1G66YZPR dsbga yzp 5 3000 220.0 220.0 34.0 package materials information www.ti.com 27-apr-2011 pack materials-page 2




important notice texas instruments incorporated and its subsidiaries (ti) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. all products are sold subject to ti ? s terms and conditions of sale supplied at the time of order acknowledgment. ti warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with ti ? s standard warranty. testing and other quality control techniques are used to the extent ti deems necessary to support this warranty. except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. ti assumes no liability for applications assistance or customer product design. customers are responsible for their products and applications using ti components. to minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. ti does not warrant or represent that any license, either express or implied, is granted under any ti patent right, copyright, mask work right, or other ti intellectual property right relating to any combination, machine, or process in which ti products or services are used. information published by ti regarding third-party products or services does not constitute a license from ti to use such products or services or a warranty or endorsement thereof. use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from ti under the patents or other intellectual property of ti. reproduction of ti information in ti data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. reproduction of this information with alteration is an unfair and deceptive business practice. ti is not responsible or liable for such altered documentation. information of third parties may be subject to additional restrictions. resale of ti products or services with statements different from or beyond the parameters stated by ti for that product or service voids all express and any implied warranties for the associated ti product or service and is an unfair and deceptive business practice. ti is not responsible or liable for any such statements. ti products are not authorized for use in safety-critical applications (such as life support) where a failure of the ti product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of ti products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by ti. further, buyers must fully indemnify ti and its representatives against any damages arising out of the use of ti products in such safety-critical applications. ti products are neither designed nor intended for use in military/aerospace applications or environments unless the ti products are specifically designated by ti as military-grade or " enhanced plastic. " only products designated by ti as military-grade meet military specifications. buyers acknowledge and agree that any such use of ti products which ti has not designated as military-grade is solely at the buyer ' s risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. ti products are neither designed nor intended for use in automotive applications or environments unless the specific ti products are designated by ti as compliant with iso/ts 16949 requirements. buyers acknowledge and agree that, if they use any non-designated products in automotive applications, ti will not be responsible for any failure to meet such requirements. following are urls where you can obtain information on other texas instruments products and application solutions: products applications audio www.ti.com/audio communications and telecom www.ti.com/communications amplifiers amplifier.ti.com computers and peripherals www.ti.com/computers data converters dataconverter.ti.com consumer electronics www.ti.com/consumer-apps dlp ? products www.dlp.com energy and lighting www.ti.com/energy dsp dsp.ti.com industrial www.ti.com/industrial clocks and timers www.ti.com/clocks medical www.ti.com/medical interface interface.ti.com security www.ti.com/security logic logic.ti.com space, avionics and defense www.ti.com/space-avionics-defense power mgmt power.ti.com transportation and www.ti.com/automotive automotive microcontrollers microcontroller.ti.com video and imaging www.ti.com/video rfid www.ti-rfid.com wireless www.ti.com/wireless-apps rf/if and zigbee ? solutions www.ti.com/lprf ti e2e community home page e2e.ti.com mailing address: texas instruments, post office box 655303, dallas, texas 75265 copyright ? 2011, texas instruments incorporated


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